Category:2014 video games
Category:Bethesda Game Studios games
Category:Video game mods
Category:Video game mods
Category:Video games developed in the United States
Category:Video games set in New York City
Category:Windows games
Category:Windows-only games
Category:Steam Workshop games
Category:Id Tech games
Category:Video games featuring protagonists of selectable gender
Category:Splinter Cell
Category:Single-player video games
Category:Fiction set in 1968James J. Kilbane
James Joseph Kilbane (November 11, 1865 – April 24, 1954) was an American lawyer and politician.
Born in Scranton, Pennsylvania, Kilbane attended Scranton High School and Dickinson College. He served in the United States Army during the Spanish–American War. He then studied law at Dickinson College and was admitted to the bar in 1892. Kilbane served in the Pennsylvania House of Representatives as a Democrat from 1900 to 1903. He then practiced law in Scranton, Pennsylvania and later New York City. Kilbane died at his home in Scranton, Pennsylvania after suffering a stroke.
Notes
Category:1865 births
Category:1954 deaths
Category:Politicians from Scranton, Pennsylvania
Category:Dickinson College alumni
Category:Members of the Pennsylvania House of RepresentativesThis invention relates to the method and apparatus for flattening the surface of an article such as a semiconductor wafer.
As the scale of integration in semiconductor integrated circuits continues to increase, and the components of the circuits are reduced in size, the wafer surface tends to be uneven. For example, it is known that certain of the semiconductor devices are susceptible to problems of short circuits, and in order to avoid these problems, a planarization process is employed to flatten the surface of the semiconductor wafer and reduce the surface area thereof.
The planarization process is typically conducted as follows. First, an adhesive tape having a flat side is attached to the surface of the semiconductor wafer, and then the semiconductor wafer is transported to a flattening apparatus in which a rotating flattening roller is pressed against the adhesive tape to press the wafer and flatten its surface. An example of such flattening apparatus is disclosed in Japanese Patent Unexamined Publication No. 63-193732. In this apparatus, a flattening roller is rotated about a central axis, and a wafer placed on the be359ba680
Related links: